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| 1 motorola sensor device data $"$ "##%" # " "
# %$ "##%" $ $" " " $" !! $ # ! $ !"$%" ! #$ "$ motorola's mpx4115a/MPXA4115A series sensor integrates onc hip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. the small form factor and high reliability of onchip integration make the motorola pressure sensor a logical and economical choice for the system designer. the mpx4115a/MPXA4115A series piezoresistive transducer is a stateoftheart, monolithic, signal conditioned, silicon pressure sensor. this sensor combines advanced micromachining tec hniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. features ? 1.5% maximum error over 0 to 85 c ? ideally suited for microprocessor or microcontroller based systems ? temperature compensated from 40 to +125 c ? durable epoxy unibody element or thermoplastic (pps) surface mount package application examples ? aviation altimeters ? industrial controls ? engine control ? weather stations and weather reporting devices figure 1. fully integrated pressure sensor schematic * ' '"' " !"( * 9>= " ( " ! (!$&()& #!$"'( #" " " '( " '( " &#)" &&" ' ( &) (&- $ "' " & "# #""(' #& '! #)( " $ * $ "' " & "# #""(' #& )" #- * order this document by mpx4115a/d
semiconductor technical data ? motorola, inc. 2001
integrated pressure sensor 15 to 115 kpa (2.2 to 16.7 psi) 0.2 to 4.8 volts output pin number note: pins 4, 5, and 6 are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. mpx4115a case 867 mpx4115ap case 867b 1 2 3 v out gnd v s 4 5 6 n/c n/c n/c unibody package pin number note: pins 1, 5, 6, 7, and 8 are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. 1 2 3 n/c v s gnd 5 6 7 n/c n/c n/c MPXA4115A6u case 482 MPXA4115Ac6u case 482a 4v out 8 n/c small outline package mpx4115as case 867e rev 4 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 2 motorola sensor device data maximum ratings (note) parametrics units maximum pressure (p1 p2) p max 400 kpa storage temperature t stg 40 to +125 c operating temperature t a 40 to +125 c note: exposure beyond the specified limits may cause permanent damage or degradation to the device. operating characteristics (v s = 5.1 vdc, t a = 25 c unless otherwise noted, p1 p2. decoupling circuit shown in figure 3 required to meet electrical specifications.) characteristic symbol min typ max unit pressure range p op 15 e 115 kpa supply voltage (1) v s 4.85 5.1 5.35 vdc supply current i o e 7.0 10 madc minimum pressure offset (2) (0 to 85 c) @ v s = 5.1 volts v off 0.135 0.204 0.273 vdc full scale output (3) (0 to 85 c) @ v s = 5.1 volts v fso 4.725 4.794 4.863 vdc full scale span (4) (0 to 85 c) @ v s = 5.1 volts v fss 4.521 4.590 4.659 vdc accuracy (5) (0 to 85 c) e e e 1.5 %v fss sensitivity v/p e 45.9 e mv/kpa response time (6) t r e 1.0 e ms output source current at full scale output i o+ e 0.1 e madc warmup time (7) e e 20 e ms offset stability (8) e e 0.5 e %v fss notes: 1. device is ratiometric within this specified excitation range. 2. offset (v off ) is defined as the output voltage at the minimum rated pressure. 3. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. 4. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a perc ent of span at 25 c due to all sources of error including the following: ? linearity: output deviation from a straight line relationship with pressure over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25 c. ? tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. 6. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 7. warmup time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test. mechanical characteristics characteristics typ unit weight, basic element (case 867) 4.0 grams weight, small outline package (case 482) 1.5 grams f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . archived by freescale semiconductor, inc. 2005 3 motorola sensor device data figure 2. cross sectional diagram sop (not to scale) figure 3. recommended power supply decoupling and output filtering. for additional output filtering, please refer to application note an1646. $' : #)($)( *< * " *9>= + & #" '( " '' '( $ ( &!#$ '( ' #" ' *))! &&" $ )#&# ' #" #( &! '# )( !"( figure 2 illustrates the absolute sensing chip in the basic chip carrier (case 482). figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the a/d in- put of a microprocessor or microcontroller. proper decoup- ling of the power supply is recommended. #)($)(*96=< $;1<<>;1 ;12 =9 <1.610 ?./>>7 48 5$. (-$ !, ! " figure 4. output versus absolute pressure (&"'& )"( #" * 9>= * < $ ;;9; * ' *0/ (!$ =9 figure 4 shows the sensor output signal relative to pres- sure input. typical minimum and maximum output curves are shown for operation over 0 to 85 c temperature range. the output will saturate outside of the rated pressure range. a fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the s ilicon diaphragm. the mpx4115a/MPXA4115A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. media other than dry air may have adverse effects on sensor perfor- mance and longterm reliability. contact the factory for information regarding media compatibility in your application. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . archived by freescale semiconductor, inc. 2005 4 motorola sensor device data transfer function (mpx4115a, MPXA4115A) nominal transfer value: v out = v s x (0.009 x p 0.095) (pressure error x temp. factor x 0.009 x v s ) v s = 5.1 0.25 vdc temperature error band mpx4115a, MPXA4115A series ;1.5 $948=< #$ '"&!$"! % =9 (17:1;.=>;1 48 (17:1;.=>;1 ;;9; ./=9; note: the temperature multiplier is a linear response from 0 c to 40 c and from 85 c to 125 c pressure error band ;;9; 474=< 29; $;1<<>;1 a a $;1<<>;1 48 5$. $;1<<>;1;;9;5$. $;1<<>;1 ;;9; !.@ =9 5$. a 5$. ordering information e unibody package device type options case no. mpx series order no. marking basic element absolute, element only 867 mpx4115a mpx4115a ported elements absolute, ported 867b mpx4115ap mpx4115ap absolute, stove pipe port 867e mpx4115as mpx4115a ordering information e small outline package device type options case no. mpx series order no. packing options marking basic element absolute, element only 482 MPXA4115A6u rails MPXA4115A absolute, element only 482 MPXA4115A6t1 tape and reel MPXA4115A ported element absolute, axial port 482a MPXA4115Ac6u rails MPXA4115A absolute, axial port 482a MPXA4115Ac6t1 tape and reel MPXA4115A f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . archived by freescale semiconductor, inc. 2005 5 motorola sensor device data information for using the small outline package (case 482) minimum recommended footprint for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. with the correct fottprint, the packages will selfalign when subjected to a solder reflow process. it is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. (-$, (-$, (-$, figure 5. sop footprint (case 482) 48/3 77 ' f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . archived by freescale semiconductor, inc. 2005 6 motorola sensor device data small outline package dimensions case 48201 issue o ' ' "#(' !"' #" " " (# &" " $& "' - ! #"(&# " !"' #" " !"' #" " # "#( " ) !# $&#(&)' #" !, !)! !# $&#(&)' #" *&( ')&' (-$ &( s d g 8 pl n ' ! ' ( a b c m j k pin 1 identifier h t case 482a01 issue a ' ' "#(' !"' #" " " (# &" " $& "' - ! #"(&# " !"' #" " !"' #" " # "#( " ) !# $&#(&)' #" !, !)! !# $&#(&)' #" *&( ')&' (-$ &( s d g 8 pl ' ! ' ( a b c m j k pin 1 identifier h t n v w f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . archived by freescale semiconductor, inc. 2005 7 motorola sensor device data unibody package dimensions basic element case 86708 issue n '(- $ " *#)( &#)" * * * *, pin 1 f g n l r c b m j s "#(' !"' #" " " (# &" " $& "' - ! #"(&# " !"' #" " !"' #" ' " )' * # ( !# '(#$ & " !# '(#$ & " "#( (# , a 6 pl d t ! ! ( ' ' "#! "#! '(- $ " #$" &#)" *#)( *')$$ - *#)( #$" '(- $ " #$" &#)" *#)( *')$$ - *#)( #$" positive pressure (p1) pressure side ported (ap, gp) case 867b04 f issue f '(- $ " * #)( &#)" * * * * , r n c j pin 1 ! % ! ( b 6x d g f s k v ' $ ! % ' ( l u a "#(' !"' #"' & " ! !(&' !"' #"' " (# &"' $& '! - ! ' ' t p p q q f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . archived by freescale semiconductor, inc. 2005 8 motorola sensor device data unibody package dimensionsecontinued pressure side ported (as, gs) case 867e03 issue d "#(' !"' #" " " (# &" " $& "' - ! #"(&# " !"' #" " '(- $ " * #)( &#)" * * * * , a c k n e b port #1 positive pressure j t s g f d 6 pl pin 1 ! ! ( ' ' v (p1) f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . archived by freescale semiconductor, inc. 2005 9 motorola sensor device data motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, represe ntation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. atypicalo parameters which may be provided in motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. motorola does not convey any license under its patent rights nor the rights of others. motor ola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other ap plications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a s ituation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized app lication, buyer shall indemnify and hold motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or dea th associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola and are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/affirmative action employer. how to reach us: usa/europe/locations not listed : motorola literature distribution; japan : motorola japan ltd.; sps, technical information center, 3201, p.o. box 5405, denver, colorado 80217. 13036752140 or 18004412447 minamiaz abu. minatoku, tokyo 1068573 japan. 8 1334403569 technical information center: 18005216274 asia/pacific : motorola semiconductors h.k. ltd.; silicon harbour centre, 2, dai king street, tai po industrial estate, tai po, n.t., hong kong. 85226668334 home page : http://www.motorola.com/semiconductors/ mpx4115a/d ? f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . archived by freescale semiconductor, inc. 2005 |
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